Wednesday, January 05, 2005

Short Stack

Michael B. Ball has assigned his patent (US 6,784,023 B2) to Micron Technology, Inc., for
a method of fabrication of stacked semiconductor devices. As they are both in Boise, Idaho, it's a fair bet that he works for Micron. This was in February 1996.
substrate stacking method drawing

The patent shows the stack of substrate elements as illustrated and describes the method.

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